Specializing in Composite Materials, Computational Mechanics, and Advanced Manufacturing
My story begins in Sirajganj, my hometown, where I learned the value of building things with my own hands and solving problems with ingenuity. This early curiosity about how things work naturally evolved into a passion for engineering, leading me to pursue a degree in Mechanical Engineering at Khulna University of Engineering & Technology (KUET).
My time at KUET was more than just earning a degree; it was about discovering my specific niche within the vast world of engineering. I became fascinated by the hidden world of materials—specifically, how composite materials like glass fiber and epoxy can be layered and designed to create structures that are stronger, lighter, and more efficient. This wasn't just theoretical for me. For my thesis, I delved into the complex world of printed circuit boards (PCBs), utilizing computational tools such as Abaqus to simulate their behavior under pressure, including bending and stress. Seeing my research validated and later published was a powerful moment; it showed me that I could contribute to real-world understanding and help bridge the gap between theoretical design and practical, reliable application.
My goal is to now take this foundational experience and deepen it through graduate studies. I aim to contribute to research that pushes the boundaries of material science, creating next-generation composites that enhance sustainability and structural integrity. I am particularly interested in exploring how these materials behave under complex, real-world conditions like impact, vibration, and extreme temperatures.
Ultimately, I want to be an engineer who doesn't just analyze data but uses it to build more resilient and efficient systems for our future. I am seeking opportunities to learn, research, and collaborate with those who are as driven by these challenges as I am.
CGPA: 3.45 / 4.00 (Last 2 years: 3.49)
Thesis: Computational Study of Multi-layer Printed Circuit Boards Under Bending Load
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Hybrid Advances, 4, p.100090. DOI: 10.1016/j.hybadv.2023.100090
This study provides a finite element analysis of the bending behavior of multi-layer printed circuit boards, highlighting the effect of ply orientation and lamina thickness on mechanical performance. The bending stiffness is maximum for the cross-ply laminate, and the introduction of angle ply improves the maximum von-Mises stress with less than 5% reduction in bending stiffness.
Academic Supervisor: Dr. Md. Kutub Uddin
This project involves the design, analysis, and fabrication of a low-cost, hand-operated die-cutting machine for small-scale applications. The goal is to create a robust and efficient device that uses a lever or rolling mechanism to apply uniform pressure, enabling precise and repeatable cuts in materials like paper, cardstock, felt, and leather.
nazmul.759293@gmail.com
+8801766759293
Telkupi, Sirajganj, Bangladesh
Available for collaboration